Chips: Four measurements on a first wafer and four measurements on a...

In BSDA: Basic Statistics and Data Analysis

Four measurements on a first wafer and four measurements on a second wafer selected from 30 lots

Description

Data for Exercise 10.9

Usage

Chips

Format

A data frame/tibble with 30 observations on eight variables

wafer11

first measurement of thickness of the oxide layer for wafer1

wafer12

second measurement of thickness of the oxide layer for wafer1

wafer13

third measurement of thickness of the oxide layer for wafer1

wafer14

fourth measurement of thickness of the oxide layer for wafer1

wafer21

first measurement of thickness of the oxide layer for wafer2

wafer22

second measurement of thickness of the oxide layer for wafer2

wafer23

third measurement of thickness of the oxide layer for wafer2

wafer24

fourth measurement of thickness of the oxide layer for wafer2

Source

Yashchin, E. 1995. “Likelihood Ratio Methods for Monitoring Parameters of a Nested Random Effect Model.” Journal of the American Statistical Association, 90, 729-738.

References

Kitchens, L. J. (2003) Basic Statistics and Data Analysis. Pacific Grove, CA: Brooks/Cole, a division of Thomson Learning.

Examples

with(data = Chips, 
     boxplot(wafer11, wafer12, wafer13, wafer14, wafer21, 
             wafer22, wafer23, wafer24, col = "pink")
)

BSDA documentation built on Sept. 19, 2023, 1:08 a.m.