printedcircuitboard: Printed circuit board accelerated life test
In Auburngrads/SMRD: Statistical Methods For Reliability Data
Description
Meeker and LuValle (1995) give data from an accelerated life test on failure of
printed circuit boards. The purpose of the experiment was to study the
effect of the stresses on the failure-time distribution and to predict
reliability under normal operating conditions. More specifically, the
experiment was designed to study a particular failure mode - the formation
and growth of conductive anodic filaments between copper-plated through-holes
in the printed circuit boards. Actual growth of the filaments could not be
monitored, only failure time (defined as a short circuit) could be observed
directly. Special test boards were constructed for the experiment.
The data provided here are the number of failures observed in each of a series of
4-hour and 12-hour long intervals over the life-test period. This experiment resulted
in interval-censored data because only the interval in which each failure occurred was
known. Further, the data are part of the results of a much larger experiment aimed at
determining the effects of temperature, relative humidity, and electric field
on the reliability of printed circuit boards.
Format
A data.frame with 140 rows and 5 variables:
[, 1] lower Start of an inspection interval (in hours) Numeric
[, 2] upper End of an inspection interval (in hours) Numeric
[, 3] count Number of events observed in the interval Numeric
[, 4] event Event observed in the interval (right-censored/interval-censored) Categoric
[, 5] rh Relative humidity applied Numeric
Source
Meeker, W. Q., and LuValle, M. J. (1995),
An accelerated life test model based on reliability kinetics,
Technometrics, 37, 133-146.
Auburngrads/SMRD documentation built on Sept. 14, 2020, 2:21 a.m.
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Description
Meeker and LuValle (1995) give data from an accelerated life test on failure of printed circuit boards. The purpose of the experiment was to study the effect of the stresses on the failure-time distribution and to predict reliability under normal operating conditions. More specifically, the experiment was designed to study a particular failure mode - the formation and growth of conductive anodic filaments between copper-plated through-holes in the printed circuit boards. Actual growth of the filaments could not be monitored, only failure time (defined as a short circuit) could be observed directly. Special test boards were constructed for the experiment.
The data provided here are the number of failures observed in each of a series of 4-hour and 12-hour long intervals over the life-test period. This experiment resulted in interval-censored data because only the interval in which each failure occurred was known. Further, the data are part of the results of a much larger experiment aimed at determining the effects of temperature, relative humidity, and electric field on the reliability of printed circuit boards.
Format
A data.frame with 140 rows and 5 variables:
| [, 1] | lower | Start of an inspection interval (in hours) | Numeric |
| [, 2] | upper | End of an inspection interval (in hours) | Numeric |
| [, 3] | count | Number of events observed in the interval | Numeric |
| [, 4] | event | Event observed in the interval (right-censored/interval-censored) | Categoric |
| [, 5] | rh | Relative humidity applied | Numeric |
Source
Meeker, W. Q., and LuValle, M. J. (1995), An accelerated life test model based on reliability kinetics, Technometrics, 37, 133-146.
R Package Documentation
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Note that we can't provide technical support on individual packages. You should contact the package authors for that.
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