solder: Soldering of Components on Printed-Circuit Boards

In swager/causalForest: Causal Trees and Forests

Description

The solder data frame has 720 rows and 6 columns, representing a balanced subset of a designed experiment varying 5 factors on the soldering of components on printed-circuit boards.

Usage

solder

Format

This data frame contains the following columns:

Opening

a factor with levels L, M and S indicating the amount of clearance around the mounting pad.

Solder

a factor with levels Thick and Thin giving the thickness of the solder used.

Mask

a factor with levels A1.5, A3, B3 and B6 indicating the type and thickness of mask used.

PadType

a factor with levels D4, D6, D7, L4, L6, L7, L8, L9, W4 and W9 giving the size and geometry of the mounting pad.

Panel

1:3 indicating the panel on a board being tested.

skips

a numeric vector giving the number of visible solder skips.

Source

John M. Chambers and Trevor J. Hastie eds. (1992) Statistical Models in S, Wadsworth and Brooks/Cole, Pacific Grove, CA.

Examples

fit <- causalTree(skips ~ Opening + Solder + Mask + PadType + Panel,
             data = solder, method = "anova")
summary(residuals(fit))
plot(predict(fit), residuals(fit))

swager/causalForest documentation built on May 30, 2019, 9:32 p.m.