STAT210prob2.29: STAT210prob2.29: The Effect of the Hexafluoroethane Flow Rate

In thoree/stat340: Data and functions for BIAS at NMBU

STAT210prob2.29: The Effect of the Hexafluoroethane Flow Rate

Description

This data is from an article in Solid State Technology (May 1987) which describes an experiment to determine the effect of the C_{2}F_{6} flow rate on the uniformity of the etch on a silicon wafer used in integrated circuit manufacturing. All the runs were made in random order, and the data are the uniformity observations of the two flow rates.

Usage

STAT210prob2.29

Format

A data frame with 12 observations (rows) and 2 variables (columns).

	Column name	Data type	Description	Values
[,1]	FlowRate	integer	2 different C_{2}F_{6} flow rates	(125 - 200)
[,2]	Uniformity	numeric	The observed uniformity	(2.6 - 5.1)

Details

This is data from Exercise 2.29 in Design and Analysis of Experiments, 9th Edition, EMEA Edition.

Source

Montgomery, D. C. (2019) Design and Analysis of Experiments, 9th Edition, EMEA Edition. New York: Wiley.

References

Yin, G.Z. and Jillie, D.W. (1987) Orthogonal Design for Process Optimization and Its Application to Plasma Etching. Solid State Technology.

See Also

STAT210example3.1, STAT210prob2.31, STAT210prob2.33, and STAT210prob2.39

Examples

# A short summary of the variables
summary(STAT210prob2.29)

# Uniformity for different flow rates of Hexafluoroethane
boxplot(Uniformity ~ FlowRate, data = STAT210prob2.29,
        col = "steelblue2")

thoree/stat340 documentation built on June 30, 2024, 4:04 p.m.