STAT210prob2.39: STAT210prob2.39: Etching of Silicon Wafers

In thoree/stat340: Data and functions for BIAS at NMBU

STAT210prob2.39: Etching of Silicon Wafers

Description

In semiconductor manufacturing, wet chemical etching is often used to remove silicon from the backs of wafers prior to metallization. The etch rate is an important characteristic of this process. Two different etching solutions are being evaluated. Eight randomly selected wafers have been etched in each solution, and the observed etch rates are reported.

Usage

STAT210prob2.39

Format

A data frame with 8 observations (rows) and 2 variables (columns).

	Column name	Data type	Description	Values
[,1]	Solution_1	numeric	Observed etch rates in mils/min	(9.3 - 10.6)
[,2]	Solution_2	numeric	Observed etch rates in mils/min	(10 - 10.7)

Details

This is data from Exercise 2.39 in Design and Analysis of Experiments, 9th Edition, EMEA Edition.

Source

Montgomery, D. C. (2019) Design and Analysis of Experiments, 9th Edition, EMEA Edition. New York: Wiley.

See Also

STAT210prob2.29, STAT210example3.1, STAT210prob2.31, and STAT210prob2.33

Examples

# A short summary of the variables
summary(STAT210prob2.39)

# Stacked data
STAT210prob2.39_stacked <- stack(STAT210prob2.39)
colnames(STAT210prob2.39_stacked) <- c("Etch_rate", "Solution")

thoree/stat340 documentation built on June 30, 2024, 4:04 p.m.