R/STAT210prob2.29.R

#' STAT210prob2.29: The Effect of the Hexafluoroethane Flow Rate
#'
#' This data is from an article in \emph{Solid State Technology} (May 1987)
#' which describes an experiment to determine the effect of the
#' C\eqn{_{2}}F\eqn{_{6}} flow rate on the uniformity of the etch on a silicon
#' wafer used in integrated circuit manufacturing. All the runs were made in
#' random order, and the data are the uniformity observations of the two flow
#' rates.
#'
#' @format A data frame with 12 observations (rows) and 2 variables (columns).
#' \tabular{llllr}{
#'   \tab \bold{Column name} \tab \bold{Data type} \tab \bold{Description} \tab \bold{Values}\cr
#'   \code{[,1]} \tab \code{FlowRate} \tab integer \tab 2 different C\eqn{_{2}}F\eqn{_{6}} flow rates \tab (125 - 200)\cr
#'   \code{[,2]} \tab \code{Uniformity} \tab numeric \tab The observed uniformity \tab (2.6 - 5.1)
#' }
#'
#' @details
#'
#' This is data from Exercise 2.29 in Design and Analysis of Experiments, 9th
#' Edition, EMEA Edition.
#'
#' @seealso `STAT210example3.1`, `STAT210prob2.31`, `STAT210prob2.33`, and `STAT210prob2.39`
#'
#' @examples
#'
#' # A short summary of the variables
#' summary(STAT210prob2.29)
#'
#' # Uniformity for different flow rates of Hexafluoroethane
#' boxplot(Uniformity ~ FlowRate, data = STAT210prob2.29,
#'         col = "steelblue2")
#'
#' @source Montgomery, D. C. (2019) \emph{Design and Analysis of Experiments,
#' 9th Edition, EMEA Edition}. New York: Wiley.
#'
#' @references Yin, G.Z. and Jillie, D.W. (1987) Orthogonal Design for Process
#' Optimization and Its Application to Plasma Etching.
#' \emph{Solid State Technology}.
#'
#' @docType data
#' @keywords datasets
#' @name STAT210prob2.29
#' @usage STAT210prob2.29
#'
"STAT210prob2.29"
thoree/stat340 documentation built on June 30, 2024, 4:04 p.m.