semiconductor: Semiconductor data set from GenStat.

In hglm.data: Data for the 'hglm' Package

Description

The semiconductor data set is obtained from a 2^(6-2) factorial design conducted in a semiconductor plant. The design variables, Lamination (3 factors; Temperature, Time and Pressure) and Firing (3 factors; Temperature, Cycle Time and Dew Point), are each taken at two levels. The goal of the original data analysis was to model the curvature or camber (taken in 1e-4 in./in.) as a function of the desing variables. The data set is taken from GenStat 11.1. It is also used in Lee et al. (2006) where Mayers et al. (2002) is reffered to as the the original source of the data.

Format

This data set contains 64 rows and the following columns

Device

Subtrate device

x1

Lamination Temperature; two levels +1 and -1.

x2

Lamination Time; two levels: +1 and -1.

x3

Lamination Presure; two levels: +1 and -1.

x4

Firing Temperature; two levels: +1 and -1.

x5

Firing Cycle Time; two levels: +1 and -1.

x6

Firing Dew Point: two levels: +1 and -1.

y

Camber measure; in 1e-4 in./in.

Source

GenStat(R) Release 11.1. VSN International Limited.

References

Lee, Y. and Nelder J. A., and Pawitan, Y. 2006. Generalized Linear Models with Random Effectes, Chapman and Hall/CRC.
Mayers, P. H., Montgomery, D. C. and Vining G. G. 2002. Generalized Linear Models with Application in Engineering and Science, John Wiley and Sons.

hglm.data documentation built on May 1, 2019, 6:34 p.m.