problem2.29: problem2.29
In nganbaohuynh/stat210: Datasets for the course STAT210 (NMBU)
problem2.29 R Documentation
problem2.29
Description
Data from Exercise 2.29 in "Montgomery, D. Design and Analysis of Experiments. 9th Ed. Wiley."
Usage
problem2.29
Format
An article in Solid State Technology, "Orthogonal Design for Process Optimization
and Its Application to Plasma Etching" by G.Z. Yin and D.W. Jillie (May 1987)
describes an experiment to determine the effect of the C2F6 flow rate on the
uniformity of the etch on a silicon wafer used in integrated circuit manufacturing.
All of the runs were made in random order. Data are the uniformity observation of the two flow rates.
Examples
summary(problem2.29)
nganbaohuynh/stat210 documentation built on Aug. 20, 2022, 10:08 p.m.
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| problem2.29 | R Documentation |
problem2.29
Description
Data from Exercise 2.29 in "Montgomery, D. Design and Analysis of Experiments. 9th Ed. Wiley."
Usage
problem2.29
Format
An article in Solid State Technology, "Orthogonal Design for Process Optimization and Its Application to Plasma Etching" by G.Z. Yin and D.W. Jillie (May 1987) describes an experiment to determine the effect of the C2F6 flow rate on the uniformity of the etch on a silicon wafer used in integrated circuit manufacturing. All of the runs were made in random order. Data are the uniformity observation of the two flow rates.
Examples
summary(problem2.29)
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