problem2.39: problem2.39
In nganbaohuynh/stat210: Datasets for the course STAT210 (NMBU)
problem2.39 R Documentation
problem2.39
Description
Data from Exercise 2.39 in "Montgomery, D. Design and Analysis of Experiments. 9th Ed. Wiley."
Usage
problem2.39
Format
In semiconductor manufacturing, wet chemical etching is often used to
remove silicon from the backs of wafers prior to metalization, The etch rate is an important
characteristic of this process. two different etching solutions are being evaluated. Eight
randomly selected wafers have been etched in each solution, and the observed etch rates (in mils/min)
are reported.
Examples
summary(problem2.39)
nganbaohuynh/stat210 documentation built on Aug. 20, 2022, 10:08 p.m.
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| problem2.39 | R Documentation |
problem2.39
Description
Data from Exercise 2.39 in "Montgomery, D. Design and Analysis of Experiments. 9th Ed. Wiley."
Usage
problem2.39
Format
In semiconductor manufacturing, wet chemical etching is often used to remove silicon from the backs of wafers prior to metalization, The etch rate is an important characteristic of this process. two different etching solutions are being evaluated. Eight randomly selected wafers have been etched in each solution, and the observed etch rates (in mils/min) are reported.
Examples
summary(problem2.39)
R Package Documentation
Browse R Packages
We want your feedback!
Note that we can't provide technical support on individual packages. You should contact the package authors for that.
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