solder.balance: Soldering of Components on Printed-Circuit Boards

In rpart: Recursive Partitioning and Regression Trees

Soldering of Components on Printed-Circuit Boards

Description

The solder.balance data frame has 720 rows and 6 columns, representing a balanced subset of a designed experiment varying 5 factors on the soldering of components on printed-circuit boards.

The solder data frame is the full version of the data with 900 rows. It is located in both the rpart and the survival packages.

Usage

solder

Format

This data frame contains the following columns:

Opening

a factor with levels ‘⁠L⁠’, ‘⁠M⁠’ and ‘⁠S⁠’ indicating the amount of clearance around the mounting pad.

Solder

a factor with levels ‘⁠Thick⁠’ and ‘⁠Thin⁠’ giving the thickness of the solder used.

Mask

a factor with levels ‘⁠A1.5⁠’, ‘⁠A3⁠’, ‘⁠B3⁠’ and ‘⁠B6⁠’ indicating the type and thickness of mask used.

PadType

a factor with levels ‘⁠D4⁠’, ‘⁠D6⁠’, ‘⁠D7⁠’, ‘⁠L4⁠’, ‘⁠L6⁠’, ‘⁠L7⁠’, ‘⁠L8⁠’, ‘⁠L9⁠’, ‘⁠W4⁠’ and ‘⁠W9⁠’ giving the size and geometry of the mounting pad.

Panel

1:3 indicating the panel on a board being tested.

skips

a numeric vector giving the number of visible solder skips.

Source

John M. Chambers and Trevor J. Hastie eds. (1992) Statistical Models in S, Wadsworth and Brooks/Cole, Pacific Grove, CA.

Examples

fit <- rpart(skips ~ Opening + Solder + Mask + PadType + Panel,
             data = solder.balance, method = "anova")
summary(residuals(fit))
plot(predict(fit), residuals(fit))

rpart documentation built on May 29, 2024, 8:38 a.m.