Description Format Source See Also
Observations from an accelerated life test performed on an integrated circuit device called "Device C". Failures were caused by a chemical reaction inside the circuit package. Reliability engineers tested 10 circuits at five different temperatures over a period of 3000 hours. The purpose of the experiment was to estimate the activation energy of the failure-causing reaction and to obtain an estimate of the integrated circuit life distribution at an 80 degrees celsius junction temperature.
A data.frame with 26 rows and 4 variables:
| [, 1] | celsius | Temperature to which a device was exposed during the test | Numeric |
| [, 2] | kilohours | Accumulated time at event | Numeric |
| [, 3] | event | Event observed at hours (failure/right-censored) | Categoric |
| [, 4] | count | Number of events observed at hours | Numeric |
Meeker, W. Q. and Escobar, L. A. (1998), Statistical Methods for Reliability Data, New York, NY; John Wiley & Sons.
Other data-done: alloya,
at7987, bearingcage,
berkson20, bleed,
ceramicbearing, cirpack6,
comptime, computerlab,
cylinder, devicea,
deviceb, deviceg,
fan, gaaslaser,
grampus, grids1,
halfbeak, heatexchanger,
lfp1370, lfptrun100,
lzbearing, metalwear,
mylarsub, nicdbattery,
piccioto,
printedcircuitboard,
resistor2, resistor,
superalloy, tantalum,
turbine, v7tube,
valveseat, zelencap
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