devicec: Integrated Circuit Accelerated Life Test

Description Format Source See Also

Description

Observations from an accelerated life test performed on an integrated circuit device called "Device C". Failures were caused by a chemical reaction inside the circuit package. Reliability engineers tested 10 circuits at five different temperatures over a period of 3000 hours. The purpose of the experiment was to estimate the activation energy of the failure-causing reaction and to obtain an estimate of the integrated circuit life distribution at an 80 degrees celsius junction temperature.

Format

A data.frame with 26 rows and 4 variables:

[, 1] celsius Temperature to which a device was exposed during the test Numeric
[, 2] kilohours Accumulated time at event Numeric
[, 3] event Event observed at hours (failure/right-censored) Categoric
[, 4] count Number of events observed at hours Numeric

Source

Meeker, W. Q. and Escobar, L. A. (1998), Statistical Methods for Reliability Data, New York, NY; John Wiley & Sons.

See Also

Other data-done: alloya, at7987, bearingcage, berkson20, bleed, ceramicbearing, cirpack6, comptime, computerlab, cylinder, devicea, deviceb, deviceg, fan, gaaslaser, grampus, grids1, halfbeak, heatexchanger, lfp1370, lfptrun100, lzbearing, metalwear, mylarsub, nicdbattery, piccioto, printedcircuitboard, resistor2, resistor, superalloy, tantalum, turbine, v7tube, valveseat, zelencap


Auburngrads/SMRD.data documentation built on May 13, 2019, 10:02 a.m.